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Part No: GT1155HS-QSBDTL1
img{max-width:100%} Samsung Elinx BCR Gateway AMAT Applied Materials Working Surplus
LL ELEVATOR
375-0167-01
DEVICENET MASTER-SLAVE UNIT (Qty
Sanken HWM900-004 Power Supply Panasonic Flip Chip Bonder System Used Working Part No: GT1155HS-QSBDTL1Sanken HWM900 004 Power Supply Panasonic Flip Chip Bonder System Used Working Inventory # A 13825 Part No: HWM900 004 Input: 120 230VAC, 13A, 50 60Hz Output: 5V 40A, 12V 8. 3A, 12V 8. 3A, 24V 4. 1A, 36V 5. 6A Removed from a Panasonic FB30T M Create Flip Chip Bonder System Made in Japan This Sanken HWM900 004 Power Supply is used working surplus. Removed from a Panasonic FB30T M Create Flip Chip Bonder System. The physical condition is good, but there
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